Once the menu is open you can move between options with the arrow keys and select an option with the enter or space keys. Typeahead search is also available.
Go To Home Page
Go to Home Page

Hidrogen Aktif untuk Aliran Ulang Tanpa Fluks untuk Kemasan Tingkat Wafer

Inovasi eksklusif yang dipatenkan untuk aplikasi pengemasan tingkat wafer, termasuk wafer bump dan copper pillar reflow

Membangun dari 25 tahun inovasi eksklusif dan dipatenkan kami untuk industri pengemasan elektronik global, Air Products telah mengembangkan teknologi Electron Attachment (EA), teknologi penyolderan bebas fluks baru yang menggunakan hidrogen aktif pada tekanan sekitar dengan suhu awal serendah 100 ° C untuk menghilangkan oksida logam dari tonjolan solder yang dilapisi pada wafer semikonduktor dan memungkinkan reflow dari tonjolan ini untuk mendapatkan bentuk dan ukuran yang tepat untuk interkoneksi ke paket atau substrat.
CONTACT US

Electron Attachment (EA) Technology Benefits

EA Technology for Hydrogen Activation offers the following benefits for wafer bump reflow:

  • Enhances bump reflow quality (no flux-induced solder voids and wafer contaminations)
  • Improves productivity (in-line process, no need for post wafer cleaning and furnace down time cleaning)
  • Reduces cost of ownership (no need for cleaning equipment, solution, labor work, and flux)
  • Improves safety (no flux exposure, using a non-toxic and non-flammable gas mixture) 
  • Reduces environmental issues (no organic vapors, hazard residues, and CO2 emission)

Fluxless Soldering using Electron Attachment (EA) Technology

Proprietary, patented innovation for wafer level packaging applications
The EA UP 1200 Electron Attachment fluxless reflow furnace system developed by Air Products and our equipment partner Sikama International.

Electron Attachment (EA) Fluxless Reflow System

Air Products has partnered with Sikama International to introduce an electron attachment fluxless reflow system (EAUP1200) to the electronics wafer level packaging segment. The furnace is designed to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the EA technology. The activated hydrogen produces hydrogen anions, which induces reflow of the solder to a final shape in the absence of traditional flux processes.

Contact Us

​Our technical team is here to help you. Book a free consultation with one of them!

CONTACT US

RESOURCE CENTER