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Activated Hydrogen for Fluxless Reflow
Proprietary, patented innovation for wafer level packaging applications, including wafer bump and copper pillar reflow
Activated hydrogen is a novel flux-free technology based on electron attachment (EA), which can be operated at ambient pressure and normal solder reflow temperatures using non-flammable mixtures of hydrogen (less than 5% volume) in nitrogen.
Fluxless soldering using Electron Attachment (EA) Technology
A cost-effective method to reflow your bumped wafers
If you need to improve your productivity and lower your costs, then consider our fluxless Electron Attachment solution, which uses non-flammable hydrogen and nitrogen blends to replace traditional flux chemistries for wafer-level packaging.
Ask the Expert
Greg Arslanian
Global Electronics Industry Manager
"How can I improve my wafer bump/Cu pillar reflow soldering process?"
Building on our 25 years of proprietary and patented innovation for the global electronics packaging industry, Air Products has developed a novel flux-free soldering technology. It uses activated hydrogen at ambient pressure with a starting temperature as low as 100° C to remove metal oxides from electroplated solder bumps and copper pillars on semiconductor wafers and permits reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate.
The activated hydrogen technology is a novel flux-free process, which can be operated at ambient pressure and normal solder reflow temperatures using non-flammable mixtures of hydrogen (<5 vol%) in nitrogen. This technology, invented by Air Products, involves generating a large quantity of low-energy electrons. Some of the electrons attach to hydrogen molecules, forming active species for effective oxide removal.
To capitalize on this unique technology, Air Products has partnered with Sikama International to introduce an electron attachment fluxless reflow system (EAUP1200) to the electronics wafer level packaging segment. The furnace is designed to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the activated hydrogen technology. The activated hydrogen produces hydrogen anions, which induces reflow of the solder to a final shape in the absence of traditional flux processes.
The activated hydrogen technology is a novel flux-free process, which can be operated at ambient pressure and normal solder reflow temperatures using non-flammable mixtures of hydrogen (<5 vol%) in nitrogen. This technology, invented by Air Products, involves generating a large quantity of low-energy electrons. Some of the electrons attach to hydrogen molecules, forming active species for effective oxide removal.
To capitalize on this unique technology, Air Products has partnered with Sikama International to introduce an electron attachment fluxless reflow system (EAUP1200) to the electronics wafer level packaging segment. The furnace is designed to remove metal oxides from solder bumps on UBM wafers and solder caps from copper pillar wafers via the activated hydrogen technology. The activated hydrogen produces hydrogen anions, which induces reflow of the solder to a final shape in the absence of traditional flux processes.
Gases
Hydrogen
Valued for its reactive and protective properties, and used by many industries such as electronics, foods, glass, chemicals, refining and more can benefit from its unique properties to improve quality, optimize performance and reduce costs.
Nitrogen
Useful as a gas, for its inert properties, and as a liquid for cooling and freezing. Virtually any industry can benefit from its unique properties to improve yields, optimize performance and make operations safer.